IBC: TI Intros New DOCSIS 3.0 Chip

Helps Cablecos Support Faster Services

Texas Instruments Inc. (TXN) has unveiled a chip that supports CableLabs Inc.’s DOCSIS 3.0 specification for enabling cablecos to provide more bandwidth-demanding services using channel bonding technology.

The announcement was made at the annual International Broadcasters Convention (IBC) in Amsterdam.

The full implementation of DOCSIS 3.0 defines how channel bonding can support a maximum downstream bandwidth of 160 mbps as well as a 120 mbps upstream path. Some vendors’ gear doesn’t support the maximums.

TI says its product supports eight downstream channels of DOCSIS and/or digital video supporting any frequency. It also supports four channels for upstream connections. The Puma 5 DOCSIS 3.0 cable products (modems) can be reconfigured to support IP-based services such as IPTV, the vendor claims.

TI already offers as chips that support the bonding of four downstream and four upstream channels.

The Puma chips are designed to help OEMs build network and customer premises equipment that helps cablecos offer more and faster services.

Share this article: Email, Slashdot, Digg, Del.icio.us, Yahoo!MyWeb, Windows Live Favorites, Furl
Add this article feed to: RSS, My Yahoo, Newsgator, Bloglines