Fujitsu Announces WiMAX Chip Specifications

Fujitsu has announced the specifications for the company’s mobile WiMAX baseband System-on-Chip (SoC), targeted to be the first in its class to participate in WiMAX Forum Wave 2 certification. Samples will be available in August.

The Fujitsu MB86K21 802.16e uses 90nm low-leakage process technology, suited for PC cards and other media-rich mobile applications. The mixed-signal SoC has achieved an 18.6mbps transfer rate in sample installations and lab demonstrations.

“We are confident we will be able to achieve the lowest power consumption for this class of device,” said Makoto Awaga, general manager of the Mobile Solution Division, Fujitsu Limited Electronic Devices Group. “Our first test chip delivered 240mW at 18.6mbps. We expect the power draw will be far less than 500mW, even at the theoretical highest throughput of 45mbps DL. In addition, with clock-gating techniques and our proprietary low-leakage process technology, we have achieved 10mW in sleep mode. This SoC will be uniquely equipped to support demanding media-rich mobile applications in PCs and handheld devices.”

The new mobile WiMAX SoC will include:

•  All features required for WiMAX Forum Wave 2 mobile device certification
• Highly integrated 512/1024 FFT OFDMA PHY with integrated MAC processors
• Support for 5MHz and 10MHz channel bandwidths
• Adaptive modulation schemes (64QAM, 16QAM and QPSK)
• Security implementation based on AES-CCM
• Support for 2x2 STC/MIMO
• Support for antenna diversity
• USB 2.0 and card bus/PCI host interface support
• Small footprint FBGA package

Fujitsu participated in the third plugfest conducted by ETSI and AT4 wireless on May 13 in Sophia Antipolis, France, and plans to be part of the fourth Mobile WiMAX plugfest scheduled this fall.

Fujitsu www.fujitsu.com

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